Materials, Integration and Packaging Issues for High-Frequency Devices II: Symposium Held November 29-December 1, 2004, Boston, Massachussetts, U.S.A.

Name: Materials, Integration and Packaging Issues for High-Frequency Devices II: Symposium Held November 29-December 1, 2004, Boston, Massachussetts, U.S.A.
ISBN: 9781558997813

by Cho, Yong S., Shiffler, Don, Randall, Clive A.

Materials, Integration and Packaging Issues for High-Frequency Devices II: Symposium Held November 29-December 1, 2004, Boston, Massachussetts, U.S.A.

by Cho, Yong S., Shiffler, Don, Randall, Clive A.

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ISBN-13: 9781558997813
ISBN: 1558997814
Publisher: Materials Research Society

AUTHOR

Cho, Yong S., Shiffler, Don, Randall, Clive A.

SUMMARY

Cho, Yong S. is the author of 'Materials, Integration and Packaging Issues for High-Frequency Devices II: Symposium Held November 29-December 1, 2004, Boston, Massachussetts, U.S.A.' with ISBN 9781558997813 and ISBN 1558997814.

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