4571982
9781852339418
Materials for Information Technology Devices, Interconnects And Packaging
by Zschech, Ehrenfried, Whelan, Caroline, Mikolajick, Thomas
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- Condition: New
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- Condition: Good
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- Comments: Ex- library book with stamps/ stickers\r\n
Product details
- ISBN-13: 9781852339418
- ISBN: 1852339411
- Publication Date: 2005
- Publisher: Springer
AUTHOR
SUMMARY
Providing an overview of recent developments and research activities in the field of materials used in IT, this volume brings together papers dealing with materials for silicon-based semiconductor devices, nonvolatile memories, on-chip interconnects, and assembly and packaging.Zschech, Ehrenfried is the author of 'Materials for Information Technology Devices, Interconnects And Packaging', published 2005 under ISBN 9781852339418 and ISBN 1852339411.
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