Integration of Heterogeneous Thin-Films Materials and Devices: Volume 768 (MRS Proceedings)

Recent advances in thin-film layer transfer processes have opened new routes to multimaterial integration for monolithically integrated heterogeneous components and microsystems, circumventing many of the constraints for epitaxial growth of heterogeneous materials systems. Several methods for wafer bonding and lift-off are now in use for commercial production of silicon-on-insulator wafers. As the range of materials and device complexity increases, the need grows for a fundamental understanding of mechanical, electrical and chemical processes at bonded interfaces and within the components of multimaterial laminated structures. Details of layer exfoliation and transfer mechanisms also require investigation. This book addresses the science, engineering innovations and applications of multimaterial integration. Topics range from heteroepitaxy to wafer bonding and layer transfer.Atwater, H. A. is the author of 'Integration of Heterogeneous Thin-Films Materials and Devices: Volume 768 (MRS Proceedings)', published 2003 under ISBN 9781558997059 and ISBN 1558997059.