Area Array Packaging Handbook Manufacturing and Assembly

AREA ARRAY PACKAGING AT THE CUTTING EDGE The first book to bring BGA, CSP, and Flip Chip together--teaching design, application, and manufacturing how-tos. As pagers, cell phones, and other portable electronics shrink while demand for features and functions grows, the need for better, faster, smaller, cooler high-density interconnects (HDI) becomes more critical. The Area Array Packaging Handbook brings you the details you need on this rapidly expanding field in microelectronics packaging. Filled with hands-on, leading edge information engineers need for day-to-day decision making, Area Array Packaging Handbook is an unbeatable resource for success in today's fast-paced world of HDI. Look for these highlights inside: *The hottest technologies in electronics packagingBGA, CSP, and Flip Chipall in one reference *Details on MEMs technology *Pros and cons of each technology in various applications *Solutions for difficult packaging ramifications of HDI design concepts *Detailed coverage of critical reliability and testing issues *Help with design, materials, and manufacturing processes *Problem-solving approaches to conception, construction, assembly, and applications *World-class expert contributors *400 illustrations ADVANCES APPLICATIONS CONCEPTS DESIGN ECONOMICS OPIMIZATION EQUIPMENT FUTURE TECHNOLOGY MATERIALS PROCESSES PRODUCTIVITYGilleo, Kenneth B. is the author of 'Area Array Packaging Handbook Manufacturing and Assembly' with ISBN 9780071374934 and ISBN 0071374930.