Area Array Package Design Techniques in High-Density Electronics

This comprehensive tutorial on area array package design features the most important new techniques, clearly explained by a team of world-class professionals and researchers. Area Array Package Design provides hands-on expertise and leading-edge information on flip chip, BGA, and MEMs methods. * Expert design information that can save days of searching * New 3D approaches * Solutions to MEMS challenges * Coverage of economic, environmental, standards compliance, failure analysis, and other essential considerations * Technology history and background *90 illustrations clarifying key concepts From the editor of Area Array Packaging Handbook: Manufacturing and Assembly; Handbook of Flexible Circuits; and Polymer Thick FilmGilleo, Ken is the author of 'Area Array Package Design Techniques in High-Density Electronics' with ISBN 9780071428279 and ISBN 0071428275.