329474
9780791817360
Out of Stock
The item you're looking for is currently unavailable.
Wu, T. Y. is the author of 'Application of Fracture Mechanics in Electronic Packaging and Materials Presented at the 1995 Asme International Mechanical Engineering Congress and Exposition November 12-17, 1995 Dan Francisco, California' with ISBN 9780791817360 and ISBN 0791817369.
[read more]