1.
Materials in Microelectronic and Optoelectronic Packaging
by Ling, Hung C., Niwa, Koichi...
ISBN: 9780944904633
List Price: $20.00
2.
Ceramic Substrates and Packages for Electronic Applications
by Yan, Man F., O'Bryan, Henry...
ISBN: 9780916094355
List Price: $88.00